Oramir, established in 1992, developed a photoresist stripping, single step dry process utilizing Eximer Laser for the semiconductor wafer fabrication industry. The company’s technology is based on R&D conducted at Rafael - Armament Development Authority, a division of the Israeli Ministry of Defense. A successful wafer processing was demonstrated on a prototype in 1995 and the first ?-site system, L-Stripper?, was installed at the Fraunhofer Institute in Germany (a research institute funded by German industry groups). In June 1999, the company signed a strategic agreement with Applied Materials (NASDAQ: AMAT).
In May 2001, Oramir was acquired by Applied Materials.
    Status: Acquired  
    Fund II  

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